Recognizing that the printed circuit board industry
is a competitive global market, our PCB manufacturers believe in
the continued pursuit of higher technology as a key component to
their ability to succeed. They provide a broad product mix to our
customer base, building everything from high layer count, high aspect
ratio backpanels, to designs incorporating buried, blind or micro
vias.
Solder deposited on SMD
features and in PTH pads and holes. Typical solder thickness
is 0.1-1.0 mils on surface features. Solder thickness varies
by board geometry, aspect ratio, and hole size and is therefore
considered unfavorable in higher technology SMD applications.
The solder coating consists of 63%-37% eutectic SnPb.
OSP (Organic Solderability
Preservative)
A transparent organic
coating deposited on solderable features after the solder mask
process.
ENIG (Electroless Nickel,
Immersion Gold)
Electroless nickel-immersion
gold deposited on solderable features. Typically 100-200μ of
nickel is deposited and 2-8μ of gold. Applied after the solder
mask process. Full ENIG coverage under solder mask is manufacturable,
but not desirable due to reduced mask adhesion and increased
cost.
Gold Flash
Electrolytic nickel-gold
deposited on solderable features. Typically 200-400μ of nickel
is deposited, and 3-10μ of hard gold. Gold flash is applied
to solderable features after pattern plating. Additional gold
thickness (30-50μ) can be plated in selective areas.
Immersion Silver
Silver deposited on solderable
features. Typically 5-25μ of silver is deposited, with a nominal
thickness of 15μ. Immersion silver is applied after solder
mask.
White Tin
Immersion tin deposited
over copper. Typically 30-40μ is deposited. White tin is applied
after solder mask.
Combination Finishes
Typically a global solderable
finish after a selective hard/soft gold finish has been applied.
The preferred solderable finish in combination applications is
OSP. Other solderable finishes are possible, but involve more
process steps, which may increase the risk and associated costs.
Carbon Paste
A conductive carbon filled
polymer paste used for wear protection on selective copper contacts.
Typically applied 18-24 microns.
Soft Gold (Wire Bondable)
Electrolytic gold deposited
to the customer’s specified thickness (typically 30-50μ).
Gold deposit has a purity >99.9%, a hardness of 50-90 Knoop.
Soft gold is typically applied to selective features, but can
be employed as a solderable coating.
• RoHS
Compliant Bates
manufacturers can build PCB boards for you using
non-leaded surface finishes that are RoHS compliant.
Let us know your requirements when you Request
a PCB Quote.
• WEEE
Compliant Bates manufacturer
can build PCB boards for you that are
halogen free and meet WEEE requirements.
Let us know your
requirements when you Request a PCB
Quote.
